| PART |
Description |
Maker |
| AM3064-70/BZC AM3064-50GI175 AM3064-50JC068 AM3090 |
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
DIE SALE, 2.7V, 7 MIL(BIOS FLASH)
10MS, 8 SAP, IND, ROHS-B, 2.7V(BIOS FLASH)
8-SOIC,AUTO TEMP,2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, EXT TEMP, GREEN,2.7V(SERIAL EE)
10MS, 8 TSSOP, INT TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, INT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN,2.7V(SERIAL EE)
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
Field Programmable Gate Array (FPGA) 现场可编程门阵列（FPGA
10MS, 8 SOIC, INT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 PDIP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
|
Stackpole Electronics, Inc.
Ecliptek, Corp.
Analog Devices, Inc.
Glenair, Inc.
|
| PUMA2US2500I-2512 PUMA2US2500I-2510 PUMA2US2500I-2 |
10MS, 8 PDIP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7(SERIAL EE)
10MS, 8 TSSOP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE, 2.7V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 MINI-MAP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 LAP, IND TEMP, GREEN, 2.7V(SERIAL EE)
SRAM/EPROM 静态存储器/存储
10MS, DIE, 1.8V, 11 MILS THICKNESS(SERIAL EE) 静态存储器/存储
|
TDK, Corp.
TE Connectivity, Ltd.
|
| PUMA2X0211I-1570 PUMA2X0211M-9070 PUMA2X0211M-9085 |
10MS, 8 TSSOP, IND TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 SOIC, COM TEMP(SERIAL EE)
SRAM/EPROM 静态存储器/存储
|
Mitsubishi Electric, Corp.
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| AM29SL800CB-100WBI AM29SL800CT-100WBC AM29SL800CT- |
10MS, 8 TSSOP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE) x8/x16闪存EEPROM
10MS, 8 SOIC, IND TEMP, GREEN, 1.8V(SERIAL EE) x8/x16闪存EEPROM
|
Spansion, Inc.
GE Security, Inc.
Amphenol, Corp.
STMicroelectronics N.V.
Lattice Semiconductor, Corp.
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| EN1789 |
N-Channel JFET, 40V, 55 to 95uA, 0.10mS, CP
|
ON Semiconductor
|
| 5962-9466307QYC 5962-9466307QYA 5962-9466306QYA 59 |
SC70, Low-Power, General-Purpose, Dual-Supply, Rail-to-Rail Op Amps MIL-STD-1553/ARINC总线控制 RTU通讯
Low-Voltage, SPST, CMOS Analog Switches MIL-STD-1553/ARINC总线控制 RTU通讯
MIL-STD-1553/ARINC Bus Controller/RTU MIL-STD-1553/ARINC总线控制 RTU通讯
|
Intersil, Corp.
Intel, Corp.
Hamamatsu Photonics K.K.
|
| 207253-2 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; RECEPT ASSY,9 POSN,AMPLIMITE ( AMP )
|
Tyco Electronics
|
| 5-211111-4 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; AMPLI,SHELL,PLUG 11C1 ( AMP )
|
Tyco Electronics
|
| 1-1218381-0 |
Subminiature D Pin/Socket Connectors for MIL-C-24308 and MIL-C-39029; 50 POS,ASSY,PLUG,LOW PROF,109 ( AMP )
|
Tyco Electronics
|
|
